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dc.contributor.authorGong, Lei
dc.contributor.authorZhou, Chunlan
dc.contributor.authorZhu, Junjie
dc.contributor.authorWang, Wenjing
dc.contributor.authorFangxu, Ji
dc.date.accessioned2019-09-27T10:51:25Z
dc.date.available2019-09-27T10:51:25Z
dc.date.created2019-09-26T08:51:28Z
dc.date.issued2019
dc.identifier.issn1757-8981
dc.identifier.urihttp://hdl.handle.net/11250/2619130
dc.description.abstractA new passivation layer of AlOx/SiOx were prepared, in which 80 nm SiOx was prepared by spin-coating perhydropolysilazane (PHPS) and annealed at 450°C. In order to compare the passivation effect of single AlOx layers and the SiOx/AlOx stack on silicon surface, the fixed charge (Qf) in the passivated layers and chemical passivation effect were obtained by corona charge method. Fourier transform infrared spectroscopy (FTIR) and Time-of-flight secondary ion mass spectrometry (TOF-SIMS) was used to investigate the Si-H, Si-O bonds and the hydrogen profile in the passivation layer, respectively. The result reveals that the single layer of AlOx provides good field effect with a large amount of negative Qf. Furthermore, SiOx capping on AlOx have more excellent chemical passivation because of amount of H saturate the dangling bonds on the silicon surface.nb_NO
dc.language.isoengnb_NO
dc.rightsNavngivelse 4.0 Internasjonal*
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/deed.no*
dc.titlePassivation Mechanisms of Atomic Layer-deposited AlOx Films and AlOx/SiOx Stacknb_NO
dc.typeJournal articlenb_NO
dc.typePeer reviewednb_NO
dc.description.versionpublishedVersionnb_NO
dc.source.volume585nb_NO
dc.source.journalIOP Conference Series: Materials Science and Engineeringnb_NO
dc.source.issue1nb_NO
dc.identifier.doi10.1088/1757-899X/585/1/012026
dc.identifier.cristin1729281
dc.relation.projectNorges forskningsråd: 261574nb_NO
cristin.unitcode7492,1,3,0
cristin.unitnameSolenergi
cristin.ispublishedtrue
cristin.fulltextoriginal
cristin.qualitycode1


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Navngivelse 4.0 Internasjonal
Except where otherwise noted, this item's license is described as Navngivelse 4.0 Internasjonal